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Renesas(瑞萨) 原厂技术资料 - ICSpec

首页›技术资源›原厂资料›Renesas(瑞萨)

Renesas(瑞萨)

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全部原理图&设计文件技术摘要&文章封装图&引脚图解决方案白皮书消费类电子接口应用技术方案工业电子

CLCC-8, Package Outline Drawing5.0 x 3.2 x 1.17 mm Body 1.27mm PitchJX8D1 下载

CMG16 Package Outline Drawing 2.5 x 2.5 x 0.5 mm Body 0.40mm Pitch VFQFPN 下载

CMG8 Package Outline Drawing 2.0 x 2.0 x 0.5 mm Body 0.5mm Pitch DFN 下载

CMT8 Package Outline Drawing 2.0 x 2.0 x 0.75 mm Body 0.5mm Pitch DFN 下载

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CN-CNG10 PACKAGE OUTLINE(5.0 x 3.2 mm BODY COL)下载

CN-CNG16 PACKAGE OUTLINE(3.0 x 3.0 mm BODY 0.5 mm PITCH COL)下载

CN-CNG6 PACKAGE OUTLINE(5.0x3.2 mm BODY 1.27 mm PITCH)下载

CQ-CQG4 PACKAGE OUTLINE(1.6 x 2.0 x 0.85 mm Body, 1.06 X-Pitch, 1.25 mm Y-Pitch)下载

CT-CTG10 PACKAGE OUTLINE(5.0 x 3.2 mm BODY 1.27 mm PITCH COL)下载

CT-CTG6 PACKAGE OUTLINE 3.2 x 5.0 x 0.85 mm BODY 2.22 mm Pitch X, 1.27 mm Pitch Y QFN 下载

CU-CUG4 PACKAGE OUTLINE(7.0 x 5.0 x 0.85 mm Body, 3.85 mm X-Pitch, 5.08 mm Y-Pitch)下载

CU-CUG6 PACKAGE OUTLINE(7.0 x 5.0 x 0.85 mm Body, 2.54 mm PITCH)下载

CUG10 PACKAGE OUTLINE 5.0 x 7.0 x 0.85 mm BODY 2.540 Lead Pitch, 0.80 Half Etch 下载

CV-CVG4 PACKAGE OUTLINE(2.0 x 2.5 mm Body 1.35 mm X Pitch 1.62 mm Y Pitch)下载

CVBGA Package Outline Drawing 4.5 X 7.0 mm Body 0.65mm Pitch BVG52D1 下载

CX-CXG4 PACKAGE OUTLINE(2.5 x 3.2 x 0.85 mm Body, 1.75 mm X-Pitch, 2.10 mm Y-Pitch)下载

CXG6 PACKAGE OUTLINE 3.2 x 2.5 mm BODY 1.175 mm PITCH QFN COL 下载

CXW4 Package Outline Drawing 2.5 x 3.2 x 1.0 mm Body 1.65 x 2.10 mm Pitch COL 下载

d14.3： 14 Lead Ceramic Dual-In-Line Metal Seal Package 下载

D16.3： 16 Lead Ceramic Dual-In-Line Metal Seal Package 下载