|  Header Covers–Series 650 | | 2025-07-23 |
| Hi-Temp 200°C High-Frequency Interposer Test&Burn-In Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices | | 2025-01-14 |
| High-Frequency Center Probe Test Socket for Devices up to 13mm Square | | 2023-01-04 |
| High-Frequency Center Probe Test Socket for Devices up to 27mm Square | | 2023-01-04 |
| High-Frequency Center Probe Test Socket for Devices up to 40mm Square | | 2023-01-04 |
| High-Frequency Center Probe Test Socket for Devices up to 55mm Square | | 2025-04-08 |
| High-Frequency Center Probe Test Socket for Devices up to 6.5mm Square | | 2025-04-08 |
| High-Frequency Center Probe Test Socket w/Adjustable Pressure Pad for Devices up to 27mm Square | | 2025-07-17 |
| High-Frequency Interposer Socket | | 2023-01-09 |
| High-Temp (up to 250°C) RF Test Socket with Replaceable Contact Strips | | 2023-01-04 |
| High-Temp Test&Burn-in Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices | | 2025-01-14 |
| High-Temperature (250°C) Universal Zero-Insertion-Force DIP Test Socket–Series X55X | | 2023-01-04 |
| High-Temperature SOIC-to-DIP Adapter–Series 350000-10-HT | | 2023-01-04 |
| High-Temperature SOIC-to-DIP Adapter–Series 350000-10-HT | | 2023-01-04 |
| Horizontal Display DIP Socket with Bifurcated Contacts–Series 800 | | 2023-01-04 |
| Horizontal Mounting DIP Display with Collet Contacts–Series 800 Vertisocket | | 2023-01-04 |
| HIC-764-SST | | 2023-11-12 |
