资讯
规格书
分销
技术资源
芯片求购
查公司

上传规格书

页面加载中，请稍候

供需直通车点击入驻

芯片规格书搜索工具

关于我们隐私政策联系我们免责声明

iOS APP下载

Android 下载

微信公众号

微信小程序

Copyright © 2019~2024 All rights reserved icspec科技粤ICP备19119351号-3

Renesas(瑞萨) 原厂技术资料 - ICSpec

首页›技术资源›原厂资料›Renesas(瑞萨)

Renesas(瑞萨)

搜索资料

全部原理图&设计文件技术摘要&文章封装图&引脚图解决方案白皮书消费类电子接口应用技术方案工业电子

L6.1.6x1.6： 6 Lead Ultra Thin Dual Flat No-Lead Col Plastic Package(UTDFN COL)下载

L6.2x2.1Z： 6 Lead Optical Dual Flat No-Lead Plastic Package(ODFN)下载

L6.2x2： 6 Lead 2x2 Dual Flat No-lead Plastic Package(DFN)下载

L60.7x7A： 60 Lead Quad Flat No-Lead Plastic Package(QFN)下载

上一页
53
54
55
56

L60.7x7： 60 Lead Quad Flat No-Lead Plastic Package 下载

L68.10x10E： 68 Lead Step Cut Quad Flat No-Lead Plastic Package(SCQFN)下载

L68.7x7： 68 Lead Quad Flat No-Lead Plastic Package(QFN)下载

L68.8x8C： 68 Lead Quad Flat No-Lead Plastic Package 下载

l68.8x8： 68 Lead Thin Quad Flat No-lead Plastic Package 下载

L8.2.1x2.0Z： 8 Lead Optical Dual Flat No-lead Plastic Package(ODFN)下载

L8.3x3L： 8 Lead Dual Flat No-Lead Plastic Package(DFN)下载

LAG6 PACKAGE OUTLINE 2.2 x 2.0 x 0.60 mm BODY 0.80 mm PITCH ODFNP 下载

LBG8 PACKAGE OUTLINE LGA 3.35 x 3.0 mm BODY 0.70 mm PITCH 下载

LDG24 PACKAGE OUTLINE 4.0 x 4.0 mm BODY 1.0 mm Thick, 0.5mm PITCH LGA 下载

LEG32 PACKAGE OUTLINE 5.0 x 5.0 mm BODY 0.8 mm Thick, 0.5mm PITCH LGA 下载

LG-LGG64 PACKAGE OUTLINE 9.0 x 9.0 mm BODY 0.5 mm PITCH LGA 下载

LGA-12, Package Outline Drawing 3.0 x 3.0 x 0.9 mm Body, 0.5 x 1.0mm Pitch , LVG12 下载

LGA-48 Package Outline Drawing 7.0 x 7.0 mm Body Epad 5.0 x 5.0 mm 0.mm Pitch LGR48 下载

LGA24L, Package Outline Drawing 4.0 x 4.0 x 1.55 mm Body, 0.50mm Pitch LTG24T1 下载

LGA24L, Package Outline Drawing4.0 x 4.0 x 1.55 mm Body, 0.50mm PitchLTG24T1 下载