资讯
规格书
分销
技术资源
芯片求购
查公司

上传规格书

页面加载中，请稍候

供需直通车点击入驻

芯片规格书搜索工具

关于我们隐私政策联系我们免责声明

iOS APP下载

Android 下载

微信公众号

微信小程序

Copyright © 2019~2024 All rights reserved icspec科技粤ICP备19119351号-3

Renesas(瑞萨) 原厂技术资料 - ICSpec

首页›技术资源›原厂资料›Renesas(瑞萨)

Renesas(瑞萨)

搜索资料

全部原理图&设计文件技术摘要&文章封装图&引脚图解决方案白皮书消费类电子接口应用技术方案工业电子

53-DSBGA, Package Outline Drawing2.80 x 4.20 x 0.60 mm Body, 0.4mm Pitch AZR53D1 下载

54-DSBGA, Package Outline Drawing 2.820 x 4.220 x 0.500 mm Body, 0.40mm Pitch AWQ54D1 下载

54-DSBGA, Package Outline Drawing2.80 x 4.20 x 0.60 mm Body, 0.4mm PitchAZR54D1 下载

54-TSOP, Package Outline Drawing 22.22 x 10.16 x 1.00 mm Body,0.80mm Pitch PHG54D1

上一页
21
22
23
24

54L-FCCSP Package Outline Drawing 4.80 x 2.40 x 1.00, 0.40mm Pitch AVG54P1 下载

54L-FCCSP Package Outline Drawing4.80 x 2.40 x 1.00, 0.40mm PitchAVG54P1 下载

55-FCCSP, Package Outline Drawing 2.73 x 7.80 x 0.90 mm Body, 0.50 mm Pitch, AV-AVG55D1 下载

56-LGA, Package Outline Drawing8.0 x 8.0 x 0.65 mm Body, 0.5mm Pitch LKG56P1 下载

56-TSSOP Package Outline Drawing6.10 mm Body 0.50mm PitchPAG56D1 下载

56-VFQFPN, Package Outline Drawing 7.0 x 7.0 x 0.85 mm Body, 0.4mm Pitch NDV56P1 下载

56-VFQFPN, Package Outline Drawing 7.0 x 7.0 x 0.85 mm Body,0.4mm Pitch NDV56P2 下载

56-VFQFPN, Package Outline Drawing 7.00 x 7.00 x 0.90 mm Body, 5.20 x 5.20 mm Epad, 0.40mm Pitch NDG56P4 下载

57- FCCSP, Package Outline Drawing 6.0x5.0x0.92 mm Body, 0.65 mm Pitch AVG57D1 下载

6-COL, Package Outline Drawing5.0x 3.2 x 1.10 mm Body,1.27mm Pitch LTG6D1 下载

6-DSBGA Package Outline Drawing0.83 x 1.23 mm Body,0.4mm PitchAHG6D1 下载

6-DSBGA, Package Outline Drawing 0.80 x 1.30 x 0.50 mm Body, 0.50mm Pitch AHR6D1 下载

6-LGA Package Outline Drawing 3.0 x 2.41 x 0.9 mm Body, 1.0mm Pitch LHV6D1 下载

6-LGA Package Outline Drawing3.0 x 2.41 x 0.8 mm Body, 1.0mm PitchLHG6D1 下载

6-LGA, Package Outline Drawing 1.40 x 1.80 x 0.95 mm Body, 0.55mm Pitch LTV6D1 下载

6-LGA, Package Outline Drawing 2.00 x 1.60 x 0.95 mm Body, 0.73mm Pitch LLV6D1 下载