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Renesas(瑞萨) 原厂技术资料 - ICSpec

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Renesas(瑞萨)

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全部原理图&设计文件技术摘要&文章封装图&引脚图解决方案白皮书消费类电子接口应用技术方案工业电子

14-LGA Package Outline Drawing2.00 x 4.20 x 1.20 mm Body, 0.50mm PitchLJG14D2 下载

14-SOIC Package Outline Drawing0.150 Body Width, 0.050 PitchDCG14D1 下载

14-TSSOP Package Outline Drawing4.4 mm Body 0.65mm PitchPGG14D1 下载

14-TSSOP Package Outline Drawing4.4mm Body, 0.65mm PitchPGG14T1 下载

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144-CABGA, Package Outline Drawing 13.00 x 13.00 x 1.62 mm Body, 1.0 mm Pitch BCY144D1 下载

144-TFBGA, Package Outline Drawing10.0 x 10.0 x 1.20 mm Body, 0.8mm Pitch BTG144D1 下载

145-PGA,CGA Cavity Up Package Outline Drawing40.01 x 40.01 x 3.05 mm Body, 2.54mm Pitch GU145D1 下载

15-DSBGA, Package Outline Drawing 1.61 x 2.41 x 0.6 mm Body, 0.4mm Pitch AHG15D1 下载

16 LD P-DIP MARKETING DRAWING(300 MIL)下载

16-DFN Package Outline Drawing3.0 x 4.0 x 0.85 mm Body, 0.45mm Pitch Epad 1.70 x 3.30 mmNSG16P1 下载

16-DSBGA, Package Outline Drawing 1.84 x 1.87 x 0.50 mm Body, 0.40mm Pitch AWQ16D1 下载

16-LGA Package Outline Drawing3.0 x 3.0 x 1.10 mm Body, 0.5mm PitchLTG16P1 下载

16-QSOP Package Outline Drawing3.81 mm SQ Body, 0.635mm PitchPCG16D1 下载

16-SOIC Package Outline Drawing0.150 Body Width, 0.050 PitchDCG16D1 下载

16-TSSOP Package Outline Drawing 4.4mm Body, 0.65mm Pitch PGG16T1 下载

16-TSSOP, Package Outline Drawing 5.0 x 4.4 mm Body, Epad 2.7 x 2.7 mm 0.65mm Pitch ENG16P2 下载

16-TSSOP, Package Outline Drawing 5.0 x 4.4 mm Body, Epad 2.7 x 3.3 mm 0.65mm Pitch ENG16P3 下载

16-TSSOP, Package Outline Drawing 5.0 x 4.4 mm Body, Epad 3.0 x 3.0 mm 0.65mm Pitch ENG16P1 下载

16-VFQFPN Package Outline Drawing3.0 x 3.0 x 0.9 mm, 0.5 mm, 1.70 x 1.70 mm Epad NL-NLG16P2 下载

16-VFQFPN Package Outline Drawing3.0 x 3.0 x 0.90 mm, 0.50mm Pitch, 1.60 x 1.60 mm EpadNLG16P3 下载